Application
1. Applied in cutting sapphire, glass, ceramics and hard brittle non-metal materials.
2. Applied in cutting neodymium iron, boron, and ferrite materials.
3. Applied in slicing silicon materials for use of semiconductor and solar cell.
4. Applied in cutting Sic, anisotropic composite materials and various of substrate.
Products of specific parameters
Product wire diameter | Core wire diameter | Average of grit diameter | Tensile strength | Breaking load | Applications |
mm | mm | um | (N/mm2) | (N) | |
0.135±0.005 | 0.110 | 8-16 | 3800 | Min.30 | slicing |
0.145±0.005 | 0.120 | 8-16 | 3800 | Min.35 | |
0.150±0.005 | 0.120 | 10-20 | 3400 | Min.40 | |
0.220±0.01 | 0.160 | 25-35 | 3000 | Min.70 | |
0.230±0.01 | 0.160 | 30-40 | 3000 | Min.73 | |
0.240±0.01 | 0.170 | 30-40 | 3000 | Min.73 | |
0.25±0.01 | 0.180 | 30-40 | 3000 | Min.73 | Cropping Bricking Squaring Slicing |
0.320±0.015 | 0.250 | 30-40 | 3000 | Min.150 | Cropping Bricking Squaring |
40-50 | |||||
40-60 | |||||
0.370±0.015 | 0.300 | 30-40 | 3000 | Min.170 | |
40-50 | |||||
40-60 | |||||
0.420±0.015 | 0.350 | 30-40 | 3000 | Min.220 | |
40-50 | |||||
40-60 |
we can produce according to your requirements, if you have any question pls contact with us