Tin is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as

Tin (Sn)

1, Physical character:

Atomic Weight: 118.69

Melting Point: mp: 232 °C

Boiling Point: bp: 2260 °C

2, Specification:

High Purity Tin:

Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni & Pb is bellow 10 ppm;

Uitra Purity Tin:

Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of Ag, Al, Au, Ca, Co, Cu, Fe, Mg Ni & Zn is bellow 1 ppm.

3, Physical Size:

Virgulate, Ingot, Powder.

4, Usage:

It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.

5, Packing:

It is packed with dacron film, then covered with a sealed plastic film bag.

Tin ingots