chemicail composition of donding wire H08A.
C<=0.10; Mn=0.30-0.55; S<=0.030; P<=0.030; Si<=0.030; Cr<=0.20; Ni<=0.30; Cu<=0.20
C≤0.10; Mn=0.30-0.55; S≤0.030; P≤0.030; Si≤0.030; Cr≤0.20; Ni≤0.30; Cu≤0.20
bonding wire