1

layer

Sigle layer/Double layer/Multilayer

2

Material

Aluminium.FR-4,CEM-1,High TG,FR-1,FR-2

3

Board thickness

0.3mm-3.0mm

4

Max.finished board side

1200mm*600mm

5

Min.drilled hole size

0.1mm

6

min.line width

0.1mm

7

min.line spaceing

0.1mm

8

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-5.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton paking

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

ISO9001,ISO14001,ROHS

15

profiling punching

Routing,V-CUT,Beveling

16. providing OEM service to all sorts of printed circuit board assembly