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SYJ-400 ( upgraded EC-400 ) is a CE certified precise and cost effective dicing and cutting solution for R&D Lab in Materials and Micro-electronics research field. It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components at low cost. The EC-400 saw can be computerized with position accuracy of 0.01 mm or better. The sample stage with two-angle adjustmentallows customers to cut materials at the desired angle with +/- 0.5° tolerance. Laptop with software and USB cable installed and for immediate use.
SPECIFICATIONS
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Precision CNC Dicing / Cutting Saw with Accessories & Laptop and Software - SYJ-400