1.Cerium oxide 99.9% 2.Ceria with light yellow powder or white power 3.Super purity & excellent service

High-purity Ceira Powder & Polishing Slurry

Characteristics:

1. Accurate particle size distribution, strict particle control, get good processing surface during precisely polishing; 

2. More crystal lattice defects inside can easily expose fresh surface, fine polishing;

3. Highly selective polishing process (SiO2 to Si3N4)

4. Self-stop process

5.Excellent suspension stability

6. Kinds of product categories can meet different customers’requiments, different processing conditions.

Available Specifications:

Application fields	Sizes
STI processing	80nm
	100 nm
	150 nm
	200 nm
	250 nm
	300 nm
Flat glass panel polishing	1µm
	2µm
	5µm

Application Fields:

Lapping mobile phone glass, LCD glass and polishing semiconductor dielectric layer

High-purity Ceira Powder & Polishing Slurry