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INTRODUCTION
FEATURES
Improve mounting density of components on PC board
Reflow solderable
Contacts are completely sealed,enhancing reliability
Packaged with a 12mm wide embossed taping
APPLICATIONS
For operating various mobile devices
For operating various devices that require high density mounting
such as mobile phones,communication devices,compact electronic
devices
SPECIFICATION
Rating: | 50mA 12VDC |
Contact Resistance | ≤50mΩ |
Insulation Resistance | 100MΩ(minDC 250V) |
Dielectric Strength | AC250V(50/60Hz for 1minute) |
Electrically Life | ≥50,000cycles |
Environment temperature: | -25°C-70°C |
Operating Force | 180±50gf |
Travel | 0.20±0.1mm |
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