BGA Stencil, BGA reballing stencil, BGA for Sony Ericsson K850,W770 PA, CPU, Power IC, IC etc. Compatible for:1. BGA stencil kit for the repair of Sony Ericsson K850,W770 PA, CPU, Power IC, IC etc.2. Other mobile phone BGA can be also availableAbout US Our quality products with competitive prices enable us to stand on mobile Phone Accessories & Mobile Phone Spare Parts market for more than 10 ...
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