... CPU thermal management,2, Termal conduction interface material between power transistors and heat sinks, hard discs, CD and DVDdevices, ... aerials, base stations, FPC boards, notebooks,PC, mobile devices, power systems, memory modules, aerospace equipments and others.3,Features : Supreme ... 3.0Just for reference as below:CP-2.5 Test ItemUnitDataTest MethordSpecmm200*400(can help to die cut different ...