... 1.30-320# 2.Cleaning mold, shot-peening non-metal parts, ground process before painting, gluing and plating. 3.sandblast ... medi Application:Cleaning mold, shot-peening non-metal parts, ground process before painting, gluing and plating. Removing scales ... non-metal & soft metal parts. De-burring of IC.LSI semiconductor parts, electronic component, lead frame parts etc. Revel the pattern of ...