... , Ring. Back metallisation up to 1600 x 1000mm;Metallic and non-metallic bond coverage >98%Ultrasonic c-scan on bond integritySputtering ... ), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt ...