... .T.E.Elastic modulus PurposeBC-11.8511~13804055500254.511.5semiconductor(monocrystalline silicon thermal field),sintering of ceramic,vacuum furnace,Sintering and continuous ... casting of electronic partsBC-21.811~13753750500254.410semiconductor(monocrystalline silicon thermal field),sintering of ceramic,vacuum furnace,Sintering and continuous ...