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flip chip bonding

Found 133926 Products
Excellent Hot melt adhesive tape for cards industry chip bonding (KH180 hot melt)
... Adhesive strength over 120N; 2. Special for SIM card bonding; 3. ISO7816&RoHS certificated. KH180 hot melt adhesive ... market in 2007.2. Can provide balanced bonding strength between the chip modules and card body.3. More ... Adhesive strength Over 120N Working temperature Pre-bonding : 90~140°C Bonding : 160~200°C Best before 12 ... Hot melt adhesive tape for cards industry chip bonding (KH180 hot melt)
Supplier: Guangzhou Smarthand Technology Co., Ltd. [China Manufacturers]
RFID tags (UBIK-835)
... inlays, from RFID tags to paper cards and tickets, from flip-chip bonding to second lamination and printing, UBIQUE.TAG offers all-in ... .Furthermore,we have introduced the first set of Muhlbauer TAL15000 bonding machine recently and will introduce more in the near future ...
Supplier: Shanghai UBIQUE.TAG Packing Materials Co., Ltd. [China Manufacturers]
Alien9662 and M1 chip UHF RFID pvc cards
... / uhf rfid pvc cards/ Alien9662 and M1 chip card/ rfid card Key Specifications/Special Features:Chip: Mifare 1K, Mifare Ultralight, I CODE ... : AL Etching with thickness 0.03mm , Copper coil Altrasonic Embeding;Bonding: FLIP chipRead range: HF <10cm; UHF >3m-9m, depend on the ...
rfid inlay/prelam/chip - 13.56mhz mifare 1k inlay with 17 years experiences in chinese manufacture
... pre-winding coil or ultrasonic embedding copper antenna, even FLIP chip etching antenna upon the customer's requirements. The ... AL Etching; UHF: AL EtchingBondingLF: Wire Bonding, HF: FLIP chip, Wire Bonding, MOA2, UHF: FlIP chipRead rangemore than 50mm with our readerWorking temperature ... Inlay, pre-winding, ultrasonic and Flip.Among them, the cards made by Flip will have very flat surface, and ...
Supplier: Baoying County Ruifu Electric Co., Ltd. [China Manufacturers]

SLE 5528

Mar 31, 2013
SLE 5528
... recommended for use with Infi neon’s advanced FCOS (Flip Chip On Substrate) module package. Technical Features:Data Memory alterable ... M3.2 (top view) Figure 2 Pin Configuration Module Flip Chip MFC3.1 (top view) 1) Figure 3 Pad Configuration ... M3 / MFC3 Card Contact Symbol Function C1VCCSupply voltageC2RSTReset (Chip Enable)C3CLKClock inputC5GNDGroundC6N.C.Not connectedC7I/ONot connected Delivery ...
Supplier: Shanghai RealSmart Technologies Co., Ltd. [China Manufacturers]
NXP icode sli ISO15693 big rfid smart Label for DVD management
... Sli chip 3. 8-15 cm reading range Update on 30th DecNanning XinGeShan Electronic Technology Co. Ltd1. German Muhlbauer TAL5000 Bonding Line ...
Supplier: Nanning XinGeShan Electronic Technology Co., Ltd. [China Manufacturers]
13.56MHz ISO 14443A mifare ultralight paper cards
... ultralight paper cards 1. CR80 size 2. NXP Mifare ultralight chip 3. printing available 13.56MHz ISO 14443A mifare ultralight paper ... : Mifare ultralightFrequency:13.56MHzISO/IEC:ISO14443AAntenna:Aluminum etching antennaChip bonding technology: COB or flip chipReading distance:3 to 10cmPackage: customFree samples are ...
Supplier: Shanghai Zangtian Electronic Co., Ltd. [China Manufacturers]
Factory price 125KHz ISO T5557/T5567/T5577 RFID Smart Card
... • Pad Options – ATA5577M1• 100 μm × 100 μm for Wire Bonding or Flip Chip – ATA5577M2• 200 μm × 400 μm for Direct Coil BondingATA5577 Read ... EEPROM Memory: 11 Blocks (32 Bits + 1 Lock Bit)• On Chip Trimmed Capacitor• High Q-antenna Tolerance Due to Build in ...
Supplier: Shenzhen Yongkaida Technological Co., Ltd. [China Manufacturers]
ISO15693 RFID library tag
... library tag 13.56 Mhz frequency . Long distance read . Filp-chip bonding technique High quality ISO15693 RFID library tag Material: Paper, PET ... , Felica, Mifare desfireMemory512 bits, 1K byte, 1 K bits, etcProcess:Flip-chip bonded techniqueReading distance:HF:3-10cmExpected read/wtite cycles:100 ...
Supplier: Great Creativity Smart Card Co., Ltd. [China Manufacturers]

RoHS PCBA

Feb 26, 2013
RoHS PCBA
... .SMTOur surface mount PCB assembly capabilities include BGA, uBGA and flip chip assembly. Automated assembly processes are utilized throughout all stages of ...
Supplier: Yueqingshi Switchtec Co., Ltd. [China Manufacturers]
thick film Hybrid integrated circuit
... assembling process technology including Standard SMT, Lead-free,BGA and flip chip for mass production ability. 5, special process technology for high ...

HF RFID Inlay

Mar 31, 2013
HF RFID Inlay
Product Description: 1.STandard: ISO15693 2.Chip:NXP icode 2. 3.Reading distance:4-10cm. HF RFID ...
Supplier: Nanning XinGeShan Electronic Technology Co., Ltd. [China Manufacturers]
temperature controller pcb assembly
... Package (CSP),Fine pitch high pin count press fit connectors,Flip chip SOIC, TSSOPPin Through Hole (PTH)Wave solderSelective solderingSelective conformal coatingAqueous ...
Supplier: Hangzhou Singo Tech Co., Ltd. [China Manufacturers]
SMT Stencil for PCB,Stencil Maker, Steel Stencil Paste,Stencil with frame
Stencil with frame,SMT Steel Stencil Making, Customer Stencil Paste, PCB stencil for SMT, SMT Laser stencil Tin pulp stencil Opening Design (etching stencil&Laser stencil)TypePITCHPad WidthPad LengthOpening WidthOpening LengthPlate ThicknessPLCC1.27mm0.65mm2.00mm0.6mm1.95mm0.15-0.25mmQFP0.635mm0.35mm1.50mm0.32mm1.45mm0.15-0.18mmQFP0.50mm0.254-0.33mm1.25mm0.22-0.25mm1.2mm0.12-0.15mmQFP0.40mm0. ...
Supplier: Shenzhen K-Better Electrical Co., Ltd. [China Manufacturers]
Stable function liquid dispensing industrial equipment
... adhesion of hardware parts9.Coating of rationed gas,liquid filling10.Chip bondingNote The picture we attached is just for your reference ...
Supplier: Dongguan Yiren Industry Co., Ltd. [China Manufacturers]
AlN Ceramic circuit/LED PCB/LED heat-dissipation ceramic substrate
... Al2O3 thick film substrateLED AlN thin film heat-dissipation substrateFlip chip substrate:The integration of the thin film,thick film,electrode ... & Radar)3. Semiconductor Process Equipment4. Solar Cell5. Hybrid Electric Vehicles6.Flip chip/eutectic substrate7.Sensor ceramic substrate
Supplier: Potent Mechanical & Industrial (Xiamen) Co., Ltd. [China Manufacturers]
for Kingbo BGA Solder Flux RMA-218 100g
... BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.It is original made in Japan ...
Supplier: Shenzhen Shengxin Electronic Co., Limited [China Manufacturers]

rfid paper ticket

Mar 27, 2012
rfid paper ticket
RFID train Ticket 1.Frequency:13.56Mzh 2.Chip: mifare NXP,or other brand 3.Dimension:75X30mm RFID train ...
Supplier: Guangzhou Lidun Hologram Co., Ltd. [China Manufacturers]
Popular 125khz em card
... guarantee.Competitive price. The whole production in our workshop, from chip bonding to final surface treatments.Strict quality controlCreative in-house designer ...
Supplier: Shenzhen Dejian Intelligent Technology Co., Ltd. [China Manufacturers]
Nitto Denko Blue Tape For Printer Protective SPV-225
... (Any length is available)Application 1. Used in semiconductor wafer flip chip cutting protection. 2. Using of optical glass, high-grade aluminum ...
Supplier: Shantou Wingtai Packing Equipment Co., Ltd. [China Manufacturers]
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