... setting tempreture, using the chip of different size, BGA chip’s auctual heating tempreture is also different. Because ... minmum. Working Parameter: ModelChinafix CF 360Solder TypeLeaded Solder/Lead freeSMD TypeMicro bga,BGA,CSP,QFPPCB Thickness0.5mm~4mmPCB SizeW50mm*D50mm~W455 ... temperature is the meltering point of unleaded solder and leaded solder. But the solder under chip still doesn’t melt, ...