1.quick cuts 2.high precision 3.minimal loss of material 4.super thin slices 5.only water needed instead of slurry Application1. Applied in cutting sapphire, glass, ceramics and hard brittle non-metal materials.2. Applied in cutting neodymium iron, boron, and ferrite materials.3. Applied in slicing silicon materials for use of semiconductor and solar cell.4. Applied in cutting Sic, anisotropic ...