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Brand | Epoxy equivalent(g/eq) | Hydrolysable chlorine, wt% ≤ | Inorgano-chlorine, wt% ≤ | Softening | Melting viscosity | Volatile wt%≤ | Color (Gardner) ≤ | Application |
point (°C) | (mPa•s 150°C) | |||||||
CYDCN-200 | 195~210 | 0.015 | 0.0005 | 60~75 | 340~420 | 0.1 | 2 | Epoxy Molding Compound.encapsulant,electronic printing ink, laminates |
CYDCN-205 | 193~208 | 0.015 | 0.0005 | 50~60 | — | 0.1 | 2 | |
CYDCN-208 | 195~210 | 0.015 | 0.0005 | 80~95 | — | 0.15 | 2 | Printed Circuit Board,electronic printing ink |
Due to the multi-epoxy groups existing in the molecules of O-cresol formaldehyde epoxy reisin, a large amount of tight cross-bonds are formed after being cured, resulting in excellent thermal stability, mechanical strength, electricity insulation and chemicals resistance. It is mainly used in microelectronic industry. Widely used for the encapsulant of semiconductors and integrated circuits.
Novalac Epoxy Resin used for Epoxy Molding Compound