1. Surface-mounting Technology(SMT) adn Through-hole/DIp
2.0201.0402.0603 size componets SMT technology and lead free technology
3.ICT(In Circuit Test),FCT(Funtional Circuit Test) technology.
4.UL,CE.FCC,Rohs standard
5.With IPC-610D manufacturing and other international standards.
6.Nitrogen gas reflow soldering technology for SMT
7.High density interconnected board placement technology capacity.
Other requirement,
1. Capable of developing effective production process to ensure hight quality,ensure product quality and reliability.
2.Meets the international environmental protection requirement.
3.Complicated boards and comp0onents are available.
4.Provides OEM services to all sorts of printed circuit board assemblies,PCBA,PCB assembly,SMT Assembly
One-stop OEM service provider
PCB assembly and function test.
Experienced componets sourcing team
Type of productions
SMT,DIP process
ICT test
Professional engineering staff to provide technical support
OEM services are welcome
PCB assembly,PCBA,SMT,DIP assembly
Profound knowledge of contract manufacturing services
Capable of developing effective production process to ensure high quality.
ISO 9001:2008
Factory located in China
Security PCBA with 5 BGA