Printed circuit board assembly manufacturing service
-Full assembly capacity to offer module and / or finished products to customer
-Printed circuit board assembly experienced QC and inspector
-Strong sourcing ability in relative parts and components
-Experienced technical staffs in charge of product design
-Circuit board 1 to 28 layers PCB layout,fabrication PCB assembly and box build
-Enclosure cabinet case plastic injection molding,metal stamping,manufacturing and assembly
-High-precision 0201 size components SMT technology and lead-free
-RoHS compiant SMT,DIP process
-IC pre-program
-High-precision E-Tesing include:ICTin circuit,function tesst,etc.
Manufacturing capability
-PCB Size:457x567cm(max);4x3cm(Min)
-IC Pitch(min):0.2mm
-Chip Size(min):0402/1005(1.0mm)
-BGA Size:8x6mm~37x37mm
-BGA Pin Count:48pin~600pin
-Package:SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
- u-BGA Ball diameter: 0.2mm