It is 6L rigid-flex board. surface finish: Imm Gold thickness: 1.6+/-0.1mm min. hole size: 0.25mm  

Application:

Our PCB can be used for a wide range of applications in

Electronic products such as Communication equipments, Computer, Auto electronics, Medical devices, Measurement and Control systems, Aviation and Military equipment and LED lighting etc.

 

Quality control:

 

 1. 100% inspected before shipped.

2. Follow IPC-TM-650 perform reliability test.

3. Solderability test and thermal stress test.

4. Process control: QC and QA.

5. Apply for Certificate: UL, ISO9001, ISO14001.  

 

 Packing: 

 

1. Inner packing: Vacuum packing / Plastic bag.2. Outer packing: Standard carton packing.  

 

About Chintech:

 

Chintech Electronics Limited company start business since 1992,it located at Chang'an DongGuang of China , the headquarter is in HongKong ,we do also have overseas office which located in Hollandwhich names-Chintech BV.

 

We can offer:

Rigid PCB (Single-sided PCB, Double-sided PCB, Multi-layer PCB)

-Rigid-flexible PCB

-Flexible PCB

-HDI PCB

-All kinds of high class PCBs

PCB material we can use: FR1, FR2, HB,CEM1,CEM3, FR4,High TG/CTI FR4,Halogen Free, Rogers, Aluminum based, Lead free compatible, Hi Frequency.

Factory Manufacture Capability.

Item	Manufacture Capability
Material	FR1, FR2, HB, CEM1, CEM3, FR4,High TG/CTI FR4,Halogen Free, Rogers, Aluminum based, Lead free compatible, Hi Frequency.
Layer No.	1-24
Finished Board thickness	0.2 mm-3.8mm’(8 mil-150 mil)
Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp Twist	0.70%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width (a)	0.1mm (4 mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)
Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Solder mask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol. (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS,  ISO9001:2008,  SGS,  UL certificate

 Applications: