Circular metal package Material:4J29(FeNiCo) alloy/WCu alloy. Surface plating:Ni/Au plating,selective Au plating.

Circular metal package

Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and marking on the surface..

Material:4J29(FeNiCo) alloy/WCu alloy.Surface plating:Ni/Au plating,selective Au plating.

Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.

CIRCULAR METAL PACKAGE FOR HIC