(SV520)BGA kutengeneza mashine 1.Semi-auto operation 2.Optical Alignment 3.IR+Hot gas 4.Pass CE

(SV520) BGA kutengeneza mashine

Specification:

PCB dimension:       W20×D20~W450×D450mm PCB thickness:         0.5~4mm

BGA dimension:        1×1~70×70mmWorking table adjustment:   ±10mm forward/backward, ±10mm left/rightTemperature control:             K-type thermocouple, close cycle controlledPCB locating way:      Outer or Jig Bottom Pre-heater:    infrared, 3000W Nozzle heater:             hot air, 500WPower supply:             single-phase 220V, 50/60Hz, 3.5KWMachine Dimension: L700×W650×H800mm Weight: Appox.           120kgs

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