specification

Standar

common difference

Structure

parameter

Length of substrate

A

5~70

0.5% or 0.2mm

Width of substrate

B

5~70

0.5% or 0.2mm

Layers of substrate

N

6~40

Thickness of each layer

0.097

Flatness(after sintering)

0.05/10

Via interconnection

Typical via(filling via)

K

0.12,0.17

Distance between center of via(filling via)

Min2.5×K

Distance between via(filling via) and edge of substrate

F

0.4

Metallization

Linewidth(without via)

W

Min0.1

20%

Line spacing(far from via)

P

Min0.1

20%

Distance between via and line

W1

Min0.18

20%

Distance between line and edge of substrate

E

Min0.3

20%