surface: Imm Au, leyer: 8L lamination: 2 base material: Tg170 FR-4 Thickness: 1.6+/-0.1mm ItemSpecification

Layer count	4 - 30 layer
Base material	FR-4, Halogen free, High TG
Buildup structure	1 + N + 1, 2 + N + 2
Microvia	0.10mm laser drill
Aspect ratio	18 : 1 maximum
Impedance control	+/-10% standard or +/-5% advanced
Via in pad	Copper filling or resin filling plus copper capped
BGA/CSP pitch	0.40mm minimum