Metal Package Material:4J29(FeNiCo) alloy. Surface plating:Ni/Au plating,selective Au plating.

Metal Package

Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.

Material:4J29(FeNiCo)  alloy.Surface plating:Ni/Au plating,selective Au plating.

Technical requirement: All of the property index shoud conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>.

Metal Package