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Main material:
Ceramic parts:≥93.5%Al2O3
Glaze:Color white or pink, T≥1,450°
Flange:TU1 (OFHC Cu) or Ni42Fe58alloy
Copper contact: TU1 (OFHC Cu)
Solder: Ag72Cu28alloy
Gate tube: TU1 (OFHC Cu) or Ni42Fe58alloy
Technical specifications:
The all products can reach to the below standards
Leak rate:≤1×10-8 bar cm3/ sec with helium
Flatness of copper surface: ≤0.008 mm
Parallelism between copper surfaces≤0.03 mm
Concentricity between flange and copper: ≤0.5 mm
Pull test: ≥5Kn/cm2
Temperature cycling:-65°-200°,5 circles
Nickel plating thickness:2-7um
Ceramic Housings semiconductor for power Semi-conductor parts