PCB manufacturer: Competitive price fast delivery 16 years of experience in PCB industry UL,SGS,ISO9001,RoHS,QS9000,TS16949

Key Specifications

Materials: FR-4, CEM-3, Teflon, aluminum, Rogers and high TgSurface finish: lead-free HASL, immersion gold/tin/silver, OSP, gold finger plating, selective immersion gold and gold platingLayers: 1 to 22Finished holes tolerance: PTH ±0.075mmNPTH: ±0.050mmPress fit: ±0.050mmAspect ratio: 9:1Laser Microvias diameter: 0.10 to 0.25mmAspect ratio: 1:1Minimum line width/spacing: 1/2oz/18μm: 0.075/0.075mm1oz/35μm: 0.15/0.15mm2oz/70μm: 0.20/0.20mm3oz/105μm: 0.25/0.25mmSolder mask: ±0.075mmLayer to layer: ±0.060mmCopper feature to holes (outer): ±0.075mmMinimum plating drills to copper (inner): 2 to 8L (0.25mm) or 10 to 22L (0.30mm)Edge to edge tolerance: ±0.100mmHoles to edge tolerance: ±0.100mmMinimum copper to edge distance:Outer: 0.25mmInner: 0.40mmMaximum copper thickness: 140μm (4oz)Maximum board thickness: 4.80mmMinimum board thickness:2L: 0.20mm4L: 0.40mm6 ~22L: 0.60mmMinimum core thickness: 0.10mmMinimum solder mask dam: 0.10mmControlled impedance: ±7 to 10%Maximum panel size: 550 x 650mmMinimum finished holes size: 0.10mm

 

PCB production capacity Double sided PCB :200000 ft2 /MonthMultilayer PCB  :320000 ft2/MonthHDI  PCB  :    80000 ft2/Month

 

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