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We offer low-volume,Prototype and Production PCB fabrication service, for rigid or flexible, RoHScompliant, High Tg boards. All project comes with satisfaction guarantee andon-time delivery.
Technical Capabilities:
layer | 1-36 layer |
Max Board Size | 1100*599mm 43.3" * 24" |
Min Board Thickness | 4 layer 0.40mm 16mil |
| 6 layer 1.00mm 40mil |
| 8 layer 1.20mm 48mil |
| 10 layer 1.60mm 60mil |
Max Ratio of Board thickness and Via diameter | 22:1 |
Min space | 0.075mm 3mil |
Min line width | 0.075mm 3mil |
Min hole size | 0.1mm 4mil |
Min S/M bridge | 0.1mm 4mil |
Plated wall thickness | 0.025mm 1mil |
Plated hole dia tolerance | ±0.10mm 4mil |
NO Plated hole dia tolerance | ±0.05mm 2mil |
Outline tolerance | ±0.15mm 6mil |
Board thickness tolerance | ±10% |
Copper weight | 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz |
Surface finish | HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc. |
Board material | FR-4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc. |
Insulation resistance | 1012Ω (Normal) |
Current strength | 10A |
Peel strength | 1.5N/mm |
Thermal stress | 288°C20 Seconds |
Flammability | 94V-0 |
Test voltage | 50-300V |
Clean and bright workshop:
CNC DRILLING ROOM:
Automatic electroless gold plating line:
E-testing line:
Planar exposure machine:
AOI testing machine:
Soldermask&Silkscreen machine:
8 layer high Tg moulde pcb