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(DIP) Package for MEMS and various sensors
(DIP) Package for MEMS and various sensors
Supplier Info
[China Supplier]
Contact Person : Mr. Liu Leo
Tel : 86-0510-87188030
Fax : 86-0510-87185683
Product Detail
Application This product is an air-tight, highly reliable package used for various sensors, such as gyro sensors, GPS, and air

ApplicationThis product is an air-tight, highly reliable package used for various sensors, such as gyro sensors, GPS, and air bags.

 

MaterialThe main body consists of co-firing multilayer alumina ceramics and, if necessary, a metal ring for sealing that is made of an alloy of iron, nickel, and cobalt is attached with silver-brazing to the main body.

 

FeaturesThis package is best suited for the protection of sensor devices from the external environment.

(DIP) Package for MEMS and various sensors

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