The largest developer and manufaturer of TP080,UTP100silicone thermal pad, thermal gap filler pad,thermal conductive pad inChina

Thermal pad /thermal gap filler pad/thermal conductive pad Applications:

- Between electronic components such as Semiconductor,    IC, CPU.MOS and heatsink.- Led Lighting, LCD TV, Telecom device, Wireless Hub, Power supply etc- Cooling Modules, Thermal modules, in all applications where a metal housing is used as heatsink.

  

Specification sheet

Typical Properties of UTP100
Properties	Units	Metric Value	Test Method
Construction & Composition	----	Silicone & Fiberglass	----
Color	----	pink & white	Visual
Thickness Range	mm	0.5~12	----
Hardness	Shore C	10	ASTM D2240
Density	g/cc	2.0	ASTM D792
Tensile Strength	KN/m	2.5	ASTM D412
Elongation	%	60%	ASTM D412
Continuous Use Temp	°C	-40 to 150	EN344
Breakdown Voltage	Kv/mm	≥6.0	ASTM D149
Volume Impedance	ohm-cm	6.2 x 1015	ASTM D257
Dielectric Constant	1MHz	5.27	ASTM D150
Weight Damnify	----	≤1	@150°C 240H
Flame Rating	----	V-0	UL 94
Thermal Conductivity	W/m.k	1.0	ASTM E1461
UL, RoHS, REACH	----	Compliance	----

 

 

Silicone Thermal Pad Thermal Conductive Pad