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Thermal Pad/ Gap Pad / Gap Filler
They are designed to conduct heat and help by conforming to uneven surfaces. They also help cushion items prone to breakage
Features:
-Thermal conductivity: 2.4 w/m-k
-Size available: 200mm x 400mm, 300mm x 300mm, special size could be provided
-Low stress application
-Electrical isolating
-Flame retarding: V-0
Application:
1.communicaiton equipment
2.mobile, vedio, networking equipment
3.PC server/ work station
4.LED lighting, backlight module, LCD-TV, CD/ROM-DVD cooling
Application Mode:
1.filling between PCB and heat sink
2.filling between IC and heat sink or outer cove
3.filling between IC and other cooling material