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Thermal Pad/ Gap Pad / Gap Filler
Silicon thermal conductive pad
Thermal pad for laptop cpu
Thermal pad for pcb
They are designed to conduct heat and help by conforming to uneven surfaces. They also help cushion items prone to breakage
Features:
-Thermal conductivity: 2.4 w/m-k
-Size available: 200mm x 400mm, 300mm x 300mm, special size could be provided
-Low stress application
-Electrical isolating
-Flame retarding: V-0
Application:
1.communicaiton equipment
2.mobile, vedio, networking equipment
3.PC server/ work station
4.LED lighting, backlight module, LCD-TV, CD/ROM-DVD cooling
Application Mode:
1.filling between PCB and heat sink
2.filling between IC and heat sink or outer cove
3.filling between IC and other cooling material