OEM Themal Silicne Pad: 1,Material:silicon 2,Shipment:as customized 3,Color:as customzied 4,Thickness:0.1-14mm

OEM Themal Silicne Pad:

1,LED modules, and South bridges of Mother board, thermal conduction interface of heat sink, automobile heat source components, digital camera, DV, LCD panels, CPU thermal management,

2, Termal conduction interface material between power transistors and heat sinks, hard discs, CD and DVD

devices, video games, lamps, GPS, communication equipments, aerials, base stations, FPC boards, notebooks,

PC, mobile devices, power systems, memory modules, aerospace equipments and others.

3,Features : Supreme flexibility and perfect fitting. Re-workable with high ability to return to original shape.

4,Great thermal conductivity Low possibility of oil leakage makes no damage to other components.

5,Thickness may be adjustable for customer needs.

6,Thickness 0.1-14.0mm

7,Can be cut into various shapes and size according to different components.

8,Designed to provide stable and reliable performance

9,High temperature and high pressure resistant.

10,10 conductivity: 0.8,1.0,1.5,2.0,2.5,3.0

OEM Thermal silicon Pad