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Copper Clad Laminate Sheet FR1
Copper Clad Laminated Sheet (CCL) Characteristic and Application: 1. FR-4 Copper clad laminate/CCL consist of E-glass fabric, impregnated with epoxy resin and clad with electrolytic foil. It has excellent electric, mechanical and flamer retardant properties and is widely used for PWB with printed circuit on one or both side in microwave ovens, computers, communication apparatus as well as other high grade electronic instruments.
2. FR-1copper clad laminated sheet/CCL consist of bleached wood pulp paper, impregnated with flame retardant phenolic-epoxy resin and clad with electrolytic copper foil. 3. XPC Copper clad laminated sheet/CCL consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil. It has high dimension stability, good punching behavior at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc. 4. CEM-1 copper clad laminate consist of bleached wood pulp paper, impregnated with flame retardant epoxy resin and clad with single glass fabric on both sides and electrolytic copper foil.
It has high electrical and electrical strength, good flame retardancy, good dimension stability, lower bow and twist: It is widely used for computers, VCD sets, Hi-Fi acoustic devices and other high grade electronic appliances. Normal Thickness: 1.0mm, 1.2mm, 1.6mm, 2.0mm Size Available: 1030 0+2mm X12300+2mm Note: Different thickness copper foil in one side or double sides can be supplied
| Item | Test Condition | INDEX | ||
| SY-01 | SY-02 | SY-03 | ||
| Thermal Conductivity (W/m. k) | A | 1~1.5 | 1.5~2.0 | 2.0~3.0 |
| Peel Strength(N/mm) | A After thermal stress | ≥ 1.8 | ≥ 1.8 | ≥ 1.8 |
| Blister Testafter ThermalStress | A After thermal impact | 260° C2min | 288° C 2min | 300° C 2min |
| Flammability | UL94 | V-0 | V-0 | V-0 |
| ThermalResistance Max(° C/W) | A | ≤ 1.2 | ≤ 1.0 | ≤ 0.75 |
| SurfaceResistivity(MΩ . m) | AConstant humidity treatment (90%, 35 ° C, 96H) | ≥ 1× 10 5 | ≥ 1× 10 5 | ≥ 1× 10 6 |
| VolumeResistivity (MΩ . m) | A(90%, 35 ° C, 96H) | ≥ 1.8× 10 6 | ≥ 1.8× 10 6 | ≥ 1.8× 10 7 |
| Dielectric Breakdown Min (KV) | A | ≥ 2.0 | ≥ 2.5 | ≥ 3.0 |
| DielecticConstant (1MHz) | (40 ° C, 90%, 96H) | ≤ 4.4 | ≤ 3 | ≤ 2.5 |
| Dissipation Factor | (40 ° C, 90%, 96H) | ≤ 0.03 | ≤ 0.03 | ≤ 0.03 |
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Copper Clad Laminate Sheet FR1