1A1diamond grinding wheel (wet or dry grinding process) 1.D:10-750mm 2.More cost effective

ABOUT PRODUCT

Resin bond grinding wheels have the characteristics of good self-sharpening, sharp cutting, high efficiency, high resilience and best polishing, low roughness of work piece surface, less heat generating and without burning workpiece. Suitable for high efficiency and precision grinding.

Size available:

D:10-750mm

T:3-50mm

X:3-20mm

Any other size available according to customer's requirement.

Shape available:

Straight grinding wheel series

Straight cup, tapered cup, dish grinding wheel series

Applications

Resin bond diamond grinding wheels: Mainly used for machining tungsten carbide, ceramic materials, optics materials, silicon materials, magnetic materials and so on.

Resin bond CBN grinding wheels: Mainly used for machining high speed steel,cast iron and so on.

When you make an order, pls provide the following data:

Type, Sizes (Diameter, Thickness, Hole, Width and depth of abrasive layer, angle etc.), Bond, Grit, Concentration, Work piece material, Grinding process (wet or dry).

1A1diamond grinding wheel (wet or dry grinding process)