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Double-sided FPC consists of double-sided copper clad material with top and bottom cover films(PI or Green/Yellow Oil, Carbon Ink, etc). The two layers of copper circuitry with copper plating on the pads and through the printed through holes(PTH) covering the dielectric layer.
| Types: | Single-sided, Double-sided, Multi-layers (max 6 layers) fpc board and Rigid PCB, Aluminium board |
| Surface Finishing: | Gold plating, HASL(LF),Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
| Base Material: | Polyimide(Kapton) |
| Copper Foil: | ED/RA |
| Min. Line Width: | 2 mil |
| Min. Line Spacing: | 2 mil |
| Min. Hole Size: | 0.2mm |
| Max. Board Size: | 250x300mm |
| Min. Board Thickness: | 0.1mm |
| Min. Solder Mask Thickness: | 10um |
| Coverlayer: | Polyimide |
| Profiling: | Punching |
| Soldering Thermal Resistance: | 300°C/10 seconds |
| Peeling Strength: | ≥1.4kg/cm |
| Surface Resistance: | 105mΩ |
| Insulation Resistance: | 105mΩ |
| Dielectric Strength: | 9.8x105v/cm |
| Flammability: | UL-94V-0 |
| Performance Test: | 100% electrical and electricity performance test |
Double-sided FPC