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Features: 1) Profile: routed, punched, V-cut, chamfered2) No. of layers for mass production: 2 - 83) Min. hole diameter: 0.2mm. line width and spacing: 6mil 4) Max. panel size: 18" x 24"5) Board thickness: 0.4 - 3.2mm 6) Material: FR4 7) Surface finish: immersion nickel, gold plated, tin plated8) Hot air leveling: coating 9) Type of solder mask: photo imaginable solder resistant of different