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Item | technical date | |||
layers | 1-20 layers | |||
Max. Board size | 2000×610mm | |||
Min. board Thickness | 2-layer 0.15mm | |||
4-layer 0.4mm | ||||
6-layer 0.6mm | ||||
8-layer 1.5mm | ||||
10-layer 1.6~2.0mm | ||||
Min. line Width/Space | 0.1mm(4mil) | |||
Max. Copper thickness | 1-3 OZ | |||
Min. S/M Pitch | 0.1mm(4mil) | |||
Max. S/M Pitch | 0.2mm(8mil) | |||
Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | |||
Hole dia. Tolerance (NPTH) | ±0.05mm(2mil) | |||
Hole position deviation | ±0.05mm(2mil) | |||
Outline tolerance | ±0.10mm(4mil) | |||
Twist & Bent | 0.75% | |||
Insulation Resistance | >1012 Ω Normal | |||
Electric strength | >1.3kv/mm | |||
S/M abrasion | >6H | |||
Thermal stress | 288°C 10Sec | |||
Test Voltage | 50-300V | |||
Min. blind/buried via | 0.15mm (6mil) | |||
Surface Finished | HAL, ENIG, ImAg, Imsn OSP | |||
Plating,AG, Plating gold | ||||
Materials | FR4,H-TG,Teflon,Rogers, | |||
Ceramics,Aluminium, Copper base |
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