Description

Specification Inch (mm) 

Material

FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) /CEM-3/CEM-1/Al-base

Layer No.

1-12

Board thickness

0.032"(0.8mm)-0.120"(3.0mm)

Board Size

1.18"*1.18"--22.05"*28.35" (30mm*30mm--560mmX720mm)

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-3OZ

Impedance Control

±10%

Warpage

≤ 1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.007"(0.2mm)

Min Space Width (b)

0.007"(0.2mm)

Min Annular Ring

0.007"(0.2mm)

SMD Pitch (a)

0.016"(0.4mm)

BGA Pitch (b)

0.027"(0.675mm)

Register tolerance

0.05mm

Solder Mask

Min Solder Mask Dam (a)

0.007"(0.2mm)

Solder-mask Clearance (b)

0.007"(0.2mm)

Min SMT Pad spacing (c)

0.006"(0.15mm)

Solder Mask Thickness

0.001"(0.025mm)

Holes

Hole size

0.008"(0.20mm)-- 0.257"(6.5mm)

Hole Size Tolerance (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tolerance

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Data file format

GERBER file, PROTEL series,PADS2000,POWER PCB series,ODB++

Certificates 

ROHS  ISO9001:2000 ISO9001:2008  IPC  SGS  UL certificate