The raw material of the electronic melting silicon powder has been melted in high temperature, which makes it high-purified, and amorphous transparent frit. On the property aspect, it has the decent properties of low linear thermal expansion coefficient, low stress, high water logging resistance, low radioactive content, etc. We refer to the Japanese silicon powder technology requirement for epoxy molding compound application, and the particle distribution condition. We promote the producing technology of electronic melting silicon powder. The products made by this technology have a more reasonable particle distribution. As the filler of the molding compound for encapsulated integrated circuit application, it has the outstanding advantages of good flow property, low flash, and more filling amount. Its main physical and chemical properties are as the following.