HS fins with high density increase area of the heat dissipation Full Cu material, molding success one time Skiving craft wit Features:Server Type:PassiveApplicable scope:Intel LGA 775 1U Server CPU coolerMain Process:SkivingHeatsink Material:CopperHeatsink Dimension:87(L)×83(W)×23(H)mmnoise(dB):0dBheat conducting silicon:AD 66Other features:Full Cu material, molding success one timeProduct ...