... ApplicationAluminum based copper-clad laminate have excellent flame retardant, high mechanical strength,dimensional stability etc. Especially it has vey ... .82Blister test After Thermal stress/(260°C,2min)No slice,No blister3Thermal resistance°C/W1.04Thermal-conductive FactorW/m·k1. ... )(40°C,93%,96h)/0.0211CTIV23012Operating Breakdown (AC)V960 (high Thermal Conductive)aluminum Base Copper Clad Laminate